Flexible high density interconnect structure and flexibly interc

Details Flexible high density interconnect structure and flexibly interc Flexible high density interconnect structure and flexibly interc

1992-04-07

1995-09-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174254, 257684, 257700, 361761, 361762, 361764, 361776, 361780, 361792, 361755, H05K 111, H05K 114, H05K 118

Patent

active

054521823

ABSTRACT:
A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.

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