Flexible heat sink

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06919504

ABSTRACT:
Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

REFERENCES:
patent: 4619316 (1986-10-01), Nakayama et al.
patent: 4663649 (1987-05-01), Suzuki et al.
patent: 4703339 (1987-10-01), Matsuo
patent: 4888637 (1989-12-01), Sway-Tin et al.
patent: 4894060 (1990-01-01), Nestegard
patent: 4900877 (1990-02-01), Dubrow et al.
patent: 4926242 (1990-05-01), Itoh et al.
patent: 4938279 (1990-07-01), Betker
patent: 4999741 (1991-03-01), Tyler
patent: 5006924 (1991-04-01), Frankeny et al.
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5077870 (1992-01-01), Melbye et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: 5248748 (1993-09-01), Nakamura et al.
patent: 5285108 (1994-02-01), Hastings et al.
patent: 5315480 (1994-05-01), Samarov et al.
patent: 5366688 (1994-11-01), Terpstra et al.
patent: 5430609 (1995-07-01), Kikinis
patent: 5440172 (1995-08-01), Sutrina
patent: 5443876 (1995-08-01), Koskenmaki et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5523049 (1996-06-01), Terpstra et al.
patent: 5523260 (1996-06-01), Missele
patent: 5552960 (1996-09-01), Nelson et al.
patent: 5572070 (1996-11-01), Ross
patent: 5602221 (1997-02-01), Bennett et al.
patent: 5620795 (1997-04-01), Haak et al.
patent: 5653280 (1997-08-01), Porter
patent: 5660917 (1997-08-01), Fujimori et al.
patent: 5738936 (1998-04-01), Hanrahan
patent: 5745344 (1998-04-01), Baska et al.
patent: 5781412 (1998-07-01), de Sorgo
patent: 5790376 (1998-08-01), Moore
patent: 6026895 (2000-02-01), Moresco et al.
patent: 6048919 (2000-04-01), McCullough
patent: 6060009 (2000-05-01), Welygan et al.
patent: 6093961 (2000-07-01), McCullough
patent: 6106922 (2000-08-01), Cejka et al.
patent: 6204303 (2001-03-01), Osuna et al.
patent: 6280845 (2001-08-01), Kollaja et al.
patent: 6348654 (2002-02-01), Zhang et al.
patent: 6372323 (2002-04-01), Kobe et al.
patent: 6385047 (2002-05-01), McCullough et al.
patent: 6410137 (2002-06-01), Bunyan
patent: 6465561 (2002-10-01), Yarbrough et al.
patent: 6547001 (2003-04-01), McCullough et al.
patent: 6616999 (2003-09-01), Freuler et al.
patent: 6680015 (2004-01-01), McCullough
patent: 2002/0018338 (2002-02-01), McCullough
patent: 2002/0041487 (2002-04-01), McCullough et al.
patent: 2002/0108743 (2002-08-01), Wirtz
patent: 2002/0195232 (2002-12-01), Katsui
patent: 2004/0226707 (2004-11-01), Sagal et al.
patent: 1 122 779 (2001-08-01), None
patent: 11-335562 (1999-12-01), None
patent: WO 96/06321 (1996-02-01), None
patent: WO 97/43352 (1997-11-01), None
patent: WO 99/25022 (1999-05-01), None
Sagal et al., “Elastomeric Heat Sink”. U.S. Appl. No. 10/222,574, claims allowed Dec. 13, 2004, pp. 1-2.
Campbell et al., Polymer Characterization, Physical Techniques, Chapter 8, X-ray diffraction, 1989, pp. 174-181.
Kraus et al., “Convective Optimizations”, Design and Analysis of Heat Sinks, Chapter 9, 1995, pp. 239-271.
Hill, “Characterization and Performance of Thermally Conductive Epoxy Compound Fillers”, SMTA National Symposium “Emerging Packaging Technologies”, Research Triangle Park, NC, Nov. 18-21, 1996, pp. 125-131.
Chomerics Brochure, Heat Spreaders, “T-Wing® and C-Wing™ Heat Spreaders”, Oct. 1999, pp. 51-56.
3M Brochure, “Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815”, 2002.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flexible heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible heat sink will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3430164

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.