Flexible envelope for electronic component packaging

Details Flexible envelope for electronic component packaging Flexible envelope for electronic component packaging

1985-06-19

1987-03-10

Moy, Joseph Man-Fu

Special receptacle or package

For a building component

Shingle

428922, B65D 7302, B65D 8542

Patent

active

046485082

ABSTRACT:
The invention features a single film construction with two distinctly different surface characteristics for the purpose of an electronic package composite. The non-abrading outside conductive layer integrally bonded to an anti-static interior layer forms a faraday cage package characterized by surface resistivities of less than 10.sup.3 ohms per square on the outside and less than 10.sup.12 ohms per square on the inside.

REFERENCES:
patent: 4154344 (1979-05-01), Yenni, Jr. et al.
patent: 4424900 (1984-01-01), Petcavich
patent: 4471872 (1984-09-01), Dedow
patent: 4482048 (1984-11-01), Blodgett
patent: 4532099 (1985-07-01), Kaji

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