Flexible electronic device and production method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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Details

C257S059000, C257S072000, C257SE29147, C438S048000, C438S128000

Reexamination Certificate

active

10751631

ABSTRACT:
A flexible electronic device excellent in heat liberation characteristics and toughness and a production method for actualizing thereof in low cost and with satisfactory reproducibility are provided. A protection film is adhered onto the surface of a substrate on which surface a thin film device is formed. Successively, the substrate is soaked in an etching solution to be etched from the back surface thereof so as for the residual thickness of the substrate to fall within the range larger than 0 μm and not larger than 200 μm. Then, a flexible film is adhered onto the etched surface of the substrate, and thereafter the protection film is peeled to produce a flexible electronic device.

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patent: 6592969 (2003-07-01), Burroughes et al.
patent: 2003/0089913 (2003-05-01), Takayama et al.
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patent: 2002-353369 (2002-12-01), None
patent: 2002-0090917 (2002-12-01), None

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