Flexible differential interconnect cable with isolated high...

Wave transmission lines and networks – Plural channel systems – With balanced circuits

Reexamination Certificate

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C333S247000

Reexamination Certificate

active

07145411

ABSTRACT:
A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

REFERENCES:
patent: 5021866 (1991-06-01), Sudo et al.
patent: 5345205 (1994-09-01), Kornrumpf
patent: 5631446 (1997-05-01), Quan
patent: 6040524 (2000-03-01), Kobayashi et al.
patent: 6590466 (2003-07-01), Lin et al.

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