Flexible copper-coated laminate and flexible printed circuit boa

Details Flexible copper-coated laminate and flexible printed circuit boa Flexible copper-coated laminate and flexible printed circuit boa

1996-01-26

1997-06-10

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4284735, 428901, 361748, 361749, 361750, 174256, B32B 900

Patent

active

056373821

ABSTRACT:
The object of the invention is to embody further thinning of a double layer flexible printed circuit board (FPC) and provide a flexible copper-coated laminate capable of producing such a novel flexible printed circuit board distinguished in bending characteristic and heat-resistant property and provide a printed circuit board using the novel flexible copper-coated laminate. To achieve the above object, novel flexible copper-coated laminates 10 and 12 according to the present invention are respectively composed by directly forming a copper layer 16 having a thickness of 10 .mu.m or less than 10 .mu.m on a single surface or both surfaces of polyimide film 14 which is composed of polyimide polymer containing modulus of initial tensile elasticity of 400 kg/mm.sup.2 or more than 400 kg/mm.sup.2, and which has a thickness of 10 .mu.m or less than 10 .mu.m.

REFERENCES:
patent: 3499220 (1970-03-01), Hintz et al.
patent: 3764422 (1973-10-01), Koritke et al.
patent: 3766439 (1973-10-01), Isaacson
patent: 4517051 (1985-05-01), Gazdik et al.
patent: 5112462 (1992-05-01), Swisher
patent: 5137791 (1992-08-01), Swisher
patent: 5218034 (1993-06-01), Milligan et al.
Flexible Circuits Offer a Simple Solution to Chip-Carrier Mounting by Peter Kirby; Electronics Feb. 1984.

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