Flexible copper-applied substrates

Details Flexible copper-applied substrates Flexible copper-applied substrates

1991-11-04

1993-03-09

Lesmes, George F.

Stock material or miscellaneous articles

Composite

Of metal

4284735, 428901, 528 26, B32B 1508, B32B 2706, C08G 7704

Patent

active

051926199

ABSTRACT:
A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.

REFERENCES:
patent: 4609700 (1989-09-01), Kunimune et al.
patent: 4656238 (1987-04-01), Kunimune et al.
patent: 4672099 (1987-06-01), Kunimune et al.
patent: 4818806 (1989-04-01), Kunimune et al.

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