Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-06-14
2011-06-14
Arroyo, Teresa M (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S401000, C257S691000, C257S779000, C257S735000, C257S672000
Reexamination Certificate
active
07960845
ABSTRACT:
A semiconductor device such as a field-effect transistor, improved to reduce device resistance, comprises a leadframe which includes a die paddle integral with a first set of leads and a second set of leads that is electrically isolated from the first set, a semiconductor die having its lower surface positioned on, and electrically connected to, the die paddle, and a conductive layer on the upper surface of the die. At least one electrically conductive wire, preferably plural wires, extend laterally across the second surface of the semiconductor die, are in electrical contact with the conductive layer, and interconnect corresponding second leads on opposite sides of the die. The plural wires may be welded to leads in succession by alternate ball and wedge bonds on each lead. The conductive layer may be an aluminized layer on which is formed a thin layer a solderable material, such as tin. A solder is deposited on the tin layer, enmeshing the wires. The wires, which preferably are made of copper, then may be bonded to the electrically conductive layer by melting the solder paste, preferably by heating the leadframe, allowing the solder to reflow and wet the wires, and then cool to produce a low resistance mass between the leads.
REFERENCES:
patent: 3922385 (1975-11-01), Konantz et al.
patent: 4103267 (1978-07-01), Olschewski
patent: 4780795 (1988-10-01), Meinel
patent: 5409866 (1995-04-01), Sato et al.
patent: 5763952 (1998-06-01), Lynch et al.
patent: 5861662 (1999-01-01), Candelore
patent: 5926358 (1999-07-01), Dobkin et al.
patent: 5959462 (1999-09-01), Lum
patent: 6052289 (2000-04-01), Schoenfeld et al.
patent: 6242800 (2001-06-01), Munos et al.
patent: 6369454 (2002-04-01), Chung
patent: 6380048 (2002-04-01), Boon et al.
patent: 6597065 (2003-07-01), Efland
patent: 6703692 (2004-03-01), Pruitt
patent: 6770982 (2004-08-01), Liou
patent: 6841421 (2005-01-01), Aono et al.
patent: 6847101 (2005-01-01), Fjelstad et al.
patent: 6905954 (2005-06-01), Hedler et al.
patent: 7002238 (2006-02-01), Behzad
patent: 7045831 (2006-05-01), Narazaki
patent: 7064442 (2006-06-01), Lane et al.
patent: 7075329 (2006-07-01), Chen et al.
patent: 7132314 (2006-11-01), Matsunami
patent: 7135763 (2006-11-01), Stroupe
patent: 7154165 (2006-12-01), Pruitt
patent: 7154940 (2006-12-01), Scott et al.
patent: 7397137 (2008-07-01), Larking
patent: 7408260 (2008-08-01), Fjelstad et al.
patent: 7447492 (2008-11-01), Dupuis
patent: 7732930 (2010-06-01), Makino et al.
patent: 2001/0017412 (2001-08-01), Asazu et al.
patent: 2001/0040277 (2001-11-01), Lam et al.
patent: 2006/0017141 (2006-01-01), Luo et al.
patent: 2006/0276155 (2006-12-01), Feldtkeller
patent: 2007/0018338 (2007-01-01), Hosseini et al.
patent: 2007/0081280 (2007-04-01), Strzalkowski et al.
patent: 2009/0032975 (2009-02-01), Do et al.
patent: 10 2005 054 872 (2007-05-01), None
patent: 0 418 749 (1991-03-01), None
International Search Report and the Written Opinion of the International Searching Authority issued in International Patent Application No. PCT/US2008/088327 dated Jun. 23, 2009.
United States Office Action issued in U.S. Appl. No. 12/202,835 dated Jun. 22, 2010.
U.S. Appl. No. 12/202,835, filed Sep. 2, 2008.
International Preliminary Report on Patentability dated Jul. 15, 2010.
Arroyo Teresa M
Linear Technology Corporation
McDermott Will & Emery LLP
LandOfFree
Flexible contactless wire bonding structure and methodology... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flexible contactless wire bonding structure and methodology..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible contactless wire bonding structure and methodology... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2729393