Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1998-02-13
2002-04-09
Paladini, Albert W. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S207000, C257S706000, C301S064600, C301S064600, C439S092000
Reexamination Certificate
active
06369333
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to substrates, and more specifically, to a connection to a substrate.
BACKGROUND
Various devices are often attached to substrates. In some cases, such devices are encased in a conductive receptacle. The conductive receptacle is attached to mounting holes in the substrate.
FIG. 1
illustrates one prior art attachment mechanism. The substrate (PCB)
110
includes a number of mounting holes
120
,
150
, for connecting various components to the substrate
110
. A device is attached to the substrate
110
using a mounting screw
140
. (the device is not shown for clarity). Two types of mounting holes
120
,
150
are illustrated. A first mounting hole
120
is drilled through the substrate
110
. The first mounting hole
120
includes a plating
130
of tin or solder on the inside of the mounting hole. This plating
130
contacts the back-side
160
of the substrate
110
. The back-side
160
of the substrate
110
includes a ground plane
170
. Thus, if the conductive receptacle is coupled to the first mounting hole
120
, the conductive receptacle is grounded. The conductive receptacle is coupled though the plating
130
to the ground plane
170
. This grounds the conductive receptacle to the ground plane
170
.
A second mounting hole
150
is also shown. The second mounting hole
150
is not plated. Therefore, if the conductive receptacle is coupled to the second mounting hole
150
, the conductive receptacle is not grounded.
In the prior art, the decision to ground a receptacle must be made prior to manufacturing, when the substrate
110
is initially designed. Either the receptacle is designed to be grounded, or the receptacle is designed to be not grounded. One prior art solution to this is the inclusion of two sets of mounting holes
120
,
150
in the substrate. If the receptacle is to be grounded, the receptacle is attached to a first, plated, mounting hole set
120
. If the receptacle is not to be grounded, the receptacle is attached to a second, non-plated, mounting hole set
150
. This means that the traces and connections to the receptacle are duplicated around each set of mounting holes
120
,
150
. Additionally, more real-estate is used on the substrate
110
. And, finally, half the mounting holes
120
,
150
are not used, since for each receptacle two sets of mounting holes
120
,
150
are prepared. This increases manufacturing cost and complexity.
SUMMARY OF THE INVENTION
A connection system to a substrate is described. The system includes a substrate having a mounting hole designed to permit an object to be coupled to the substrate. The substrate further includes a conductive pattern around the mounting hole on the substrate. The conductive pattern is designed to contact an interface, and selectively couple a signal to the object coupled to the substrate.
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Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Paladini Albert W.
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