Flexible column die interconnects and structures including same

Details Flexible column die interconnects and structures including same Flexible column die interconnects and structures including same

2011-06-21

2011-06-21

Sarkar, Asok K (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S775000, C257SE23001, C257SE23141, C257SE23151

Reexamination Certificate

active

07964971

ABSTRACT:
A flexible column interconnect for a microelectronic substrate includes a plurality of conductive columns extending from a bond pad or other conductive terminal in substantially mutually parallel arrangement, providing redundant current paths between the bond pad and a common cap in the form of a contact pad to which they are all joined. The flexibility of the interconnect may be varied by controlling the column dimensions, height, aspect ratio, number of columns, column material and by applying a supporting layer of dielectric material to a controlled depth about the base of the columns. A large number of interconnects may be formed on a wafer, partial wafer, single die, interposer, circuit board, or other substrate.

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