Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-25
2000-08-29
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361687, 361692, 361704, 361752, 257715, 16510433, 165185, 174 163, H05K 720
Patent
active
061117498
ABSTRACT:
A method and apparatus for cooling electronic devices is suggested comprising of a thermally conductive, flexible, non-jointed cooling conduit able to house a coolant. The conduit is passed or pulled through apertures provided on two or more cold plates. The conduit and plates are then placed in thermal communication with the electronic device or assembly to be cooled. The flexibility of the conduit allows the conduit with plates to be rearranged as to conform to the contours of the device to be cooled.
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Landrock et al., "Cooling System for Semiconductor Chips," IBM Technical Disclosure Bulletin, vol. 23, No. 4, Sep. 1980, p. 1483.
Hodgson et al., "Cold Plate Vacuum Chuck for Cooling Printed Circuit Boards," Research Disclosure, No. 31491, (YO888-0769), Jun. 1990.
EG&G Wakefield Engineering Publication, Liquid Cooled Plates for Power Modules, Transistors and Diodes, Series 180-12, 180-20 and 180-26.
Lamb Charles Robert
Li Kang-Wah
Papanicolaou Elias
Tai Charles Chaolee
Datskovsky Michael
International Business Machines - Corporation
Neff, Esq. Lily
Picard Leo P.
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