Flexible circuits

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2011-07-19

2011-07-19

Lam, Cathy (Department: 1784)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S209000, C428S901000, C174S259000, C427S305000

Reexamination Certificate

active

07981508

ABSTRACT:
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

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