Flexible circuit substrate for flip-chip-on-flex applications

Details Flexible circuit substrate for flip-chip-on-flex applications Flexible circuit substrate for flip-chip-on-flex applications

2008-07-01

2008-07-01

Nguyen, Dao H (Department: 2818)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C257S698000, C257SE21590, C257SE23068, C438S612000, C438S613000, C438S622000, C174S255000, C174S261000

Reexamination Certificate

active

07394028

ABSTRACT:
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.

REFERENCES:
patent: 6831235 (2004-12-01), Enomoto et al.
patent: 6861740 (2005-03-01), Hsu
patent: 6862189 (2005-03-01), Higuchi
patent: 6891732 (2005-05-01), Takano et al.
patent: 2005/0121225 (2005-06-01), Hsu
1. Patterson et al., “Reliability of Fine Pitch Solder Bump Flip-Chip-on-Flex: Designs and Assembly Techniques, Part 1,” Flip Chip Technologies, 11 pages, 1998.

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