Flexible circuit reflow soldering process and machine

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427123, 427273, 427335, 427345, 427376G, 427380, 427398R, 427401, 228180R, 228180A, 228232, 228242, 118 6, 118600, B05D 304, B05D 142

Patent

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041156013

ABSTRACT:
A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtually all of the heat transfer fluid used in producing the vapor is recovered and retained.

REFERENCES:
patent: 3067056 (1962-12-01), Remer
patent: 3346413 (1967-10-01), Lindemann
patent: 3704165 (1972-11-01), McLain
patent: 3707762 (1973-01-01), Bochinski
patent: 3737499 (1973-06-01), Kamena
patent: 3866307 (1975-02-01), Pfahl
patent: 3904102 (1975-09-01), Chu
Dingman, Solvent Vapor Solder Reflow, IBM Tech. Div. Bulletin, vol. 13, No. 3, (8-1970), p. 639.

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