Flexible circuit laminate and method of making the same

Details Flexible circuit laminate and method of making the same Flexible circuit laminate and method of making the same

1985-07-15

1987-01-06

Herbert, Thomas J.

Stock material or miscellaneous articles

Composite

Of fluorinated addition polymer from unsaturated monomers

428422, 428432, 428463, 4284735, 428901, B32B 2708, B32B 1508

Patent

active

046346317

ABSTRACT:
A flexible circuit laminate is presented comprising a microglass reinforced fluoropolymer layer sandwiched between a polyimide substrate and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass. In a method of making the flexible circuit laminate, the polyimide substrate undergoes a preferably alkaline microetching surface treatment, followed by rinsing, drying and lamination to the microglass reinforced fluoropolymer and copper layers.

REFERENCES:
patent: 3676566 (1972-07-01), McBride
patent: 3770566 (1973-11-01), Gerow et al.
patent: 4050976 (1977-09-01), Reiters
patent: 4431698 (1984-02-01), Case et al.

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