Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-05-15
1999-07-20
Bradley, Paula
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H02R 909
Patent
active
059248734
ABSTRACT:
A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.
REFERENCES:
patent: 3433888 (1969-03-01), Tally et al.
patent: 3876964 (1975-04-01), Balaster et al.
patent: 4385341 (1983-05-01), Main
patent: 4755147 (1988-07-01), Young
patent: 4798918 (1989-01-01), Kabadi et al.
patent: 4812135 (1989-03-01), Smith
patent: 4835394 (1989-05-01), Steele
patent: 4850883 (1989-07-01), Kabadi
patent: 4860088 (1989-08-01), Smith et al.
patent: 4894015 (1990-01-01), Stockero et al.
patent: 4902236 (1990-02-01), Hasircoglu
patent: 4906803 (1990-03-01), Albrechta et al.
patent: 4991665 (1991-02-01), Kueneman
patent: 4993958 (1991-02-01), Trobough et al.
patent: 5036379 (1991-07-01), Smith et al.
patent: 5041015 (1991-08-01), Travis
patent: 5049435 (1991-09-01), Uno et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5209230 (1993-05-01), Swedlow et al.
patent: 5211565 (1993-05-01), Krajewski et al.
patent: 5281150 (1994-01-01), Bundga et al.
patent: 5357084 (1994-10-01), McKee et al.
patent: 5387764 (1995-02-01), Blom et al.
patent: 5409384 (1995-04-01), Green et al.
patent: 5456616 (1995-10-01), Fuerst et al.
patent: 5573409 (1996-11-01), Shiley et al.
IBM Technical Disclosure Bulletin, vol. 12 No. 9, Feb. 1971.
Novaflex, "Adhesiveless Interconnection System", Designed for Severe Environments, Sheldahl.
Barcley Tina
Germanski Vasil
Isola Robert A.
Pokriefka Edward T.
Roth Norman J.
Bradley Paula
Chrysler Corporation
Fuller III Roland A.
Patel T. C.
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