Flexible circuit board interconnect with strain relief

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H02R 909

Patent

active

059248734

ABSTRACT:
A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.

REFERENCES:
patent: 3433888 (1969-03-01), Tally et al.
patent: 3876964 (1975-04-01), Balaster et al.
patent: 4385341 (1983-05-01), Main
patent: 4755147 (1988-07-01), Young
patent: 4798918 (1989-01-01), Kabadi et al.
patent: 4812135 (1989-03-01), Smith
patent: 4835394 (1989-05-01), Steele
patent: 4850883 (1989-07-01), Kabadi
patent: 4860088 (1989-08-01), Smith et al.
patent: 4894015 (1990-01-01), Stockero et al.
patent: 4902236 (1990-02-01), Hasircoglu
patent: 4906803 (1990-03-01), Albrechta et al.
patent: 4991665 (1991-02-01), Kueneman
patent: 4993958 (1991-02-01), Trobough et al.
patent: 5036379 (1991-07-01), Smith et al.
patent: 5041015 (1991-08-01), Travis
patent: 5049435 (1991-09-01), Uno et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5209230 (1993-05-01), Swedlow et al.
patent: 5211565 (1993-05-01), Krajewski et al.
patent: 5281150 (1994-01-01), Bundga et al.
patent: 5357084 (1994-10-01), McKee et al.
patent: 5387764 (1995-02-01), Blom et al.
patent: 5409384 (1995-04-01), Green et al.
patent: 5456616 (1995-10-01), Fuerst et al.
patent: 5573409 (1996-11-01), Shiley et al.
IBM Technical Disclosure Bulletin, vol. 12 No. 9, Feb. 1971.
Novaflex, "Adhesiveless Interconnection System", Designed for Severe Environments, Sheldahl.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flexible circuit board interconnect with strain relief does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible circuit board interconnect with strain relief, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible circuit board interconnect with strain relief will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1316441

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.