Flexible circuit board interconnect having low thermal conductiv

Details Flexible circuit board interconnect having low thermal conductiv Flexible circuit board interconnect having low thermal conductiv

1982-03-08

1985-04-02

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

339 17F, 361398, H05K 720

Patent

active

045090955

ABSTRACT:
The invention is directed to an apparatus adapted for flexible electrical interconnection between first and second rigid circuit systems, the systems being desirably isolated thermally from each other against heat energy tending undesirably to transfer between the systems, comprising in combination, a first flexible electrical conductor extending outwardly of the first circuit system to terminate in a first end, a second flexible electrical conductor extending outwardly of the second circuit system to terminate in a second end, and a third flexible electrical conductor bridging at least the first and second ends to provide the flexible electrical interconnection between the first and second systems and characterized by low thermal conductivity relative to at least one of the first and second conductors to thermally isolate the systems. Also included are methods for providing the flexible electrical interconnection between first and second rigid circuit systems.

REFERENCES:
patent: 3213404 (1965-10-01), Hedstrom
patent: 3290756 (1966-12-01), Dreyer
patent: 3688245 (1972-08-01), Lockshaw
patent: 4104728 (1978-08-01), Kasubuchi

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