Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-25
1999-01-26
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361719, 361749, 361767, 361772, 257691, 257693, 257713, 257738, 174254, 174261, 174268, H05K 706
Patent
active
058644709
ABSTRACT:
A flexible circuit board for a ball grid array semiconductor package including a flexible resin film, a plurality of electrically conductive traces formed on an upper surface of the resin film, the conductive traces having solder ball pads, and a die flag including a semiconductor chip paddle located on a central portion of the circuit board, the chip paddle having a plurality of heat-discharging and grounding solder ball pads, and a plurality of lattice-shaped traces adapted to electrically connect the solder ball pads, the traces being shaped into a lattice to prevent a bleed-out of a silver-filled epoxy resin, a ground bonding rim located around the chip paddle, and a plurality of radial traces adapted to electrically connect the chip paddle to the ground bonding rim, and the flexible resin film being perforated to define solder ball lands on lower surfaces of the solder ball pads. Since the semiconductor chip paddle has an enlarged opened portion, it is possible to minimize the gold plated region, thereby greatly reducing the manufacturing costs. It is also possible to minimize a deformation of the package caused by mechanical stress generated due to a difference in thermal expansion coefficient between different materials of package elements. A bleed-out of silver-filled epoxy resin is also surely prevented.
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Darveaux Robert Francis
Heo Young Wook
Shim Il Kwon
Amkor Technology Inc.
Anam Semiconductor Inc.
MacDonald Thomas S.
Tolin Gerald P.
Vigushin John B.
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