Flexible circuit board and production method therefor

Details Flexible circuit board and production method therefor Flexible circuit board and production method therefor

1997-12-19

1999-06-22

Powell, William

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

216 20, 216 51, B44C 122

Patent

active

059141794

ABSTRACT:
A desired circuit wiring pattern is formed by plating a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.

REFERENCES:
patent: 3832769 (1974-09-01), Olyphant et al.
patent: 4604160 (1986-08-01), Murakami et al.
patent: 5160409 (1992-11-01), Moore et al.
patent: 5317801 (1994-06-01), Tanaka et al.
patent: 5448020 (1995-09-01), Pendse
patent: 5759417 (1998-06-01), Inaba

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