Flexible circuit board and production method therefor

Details Flexible circuit board and production method therefor Flexible circuit board and production method therefor

1996-09-30

1998-06-02

Beck, Shrive P.

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

427 96, 427 97, 430312, 430315, 430319, H01B 1322

Patent

active

057594171

ABSTRACT:
A desired circuit wiring pattern is formed by forming by plating means a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching means using a resist layer. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.

REFERENCES:
patent: 4604160 (1986-08-01), Murakami et al.
patent: 5448020 (1995-09-01), Pendse

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