Flexible circuit board

Details Flexible circuit board Flexible circuit board

2005-03-15

2005-03-15

Meier, Stephen D. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C361S750000, C174S254000, C029S830000, C029S831000, C029S840000, C029S846000, C029S884000, C029S890100

Reexamination Certificate

active

06866368

ABSTRACT:
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.

REFERENCES:
patent: 6705007 (2004-03-01), Kurita et al.
patent: 1256613 (2000-06-01), None
patent: 296536 (1997-01-01), None
patent: 350785 (1999-01-01), None
Korsten, G.H., Photosensitive Soldering Masks. In: Circuit Board 86, vol. 1, Production of circuit boards today, VDI/VDE-Gesellschaft Feinwerktechnik, Dusseldorf, 1986, pp. 84-91.
Hummel, M., Introduction into the circuit board technology, Eugen Lenze Verlag, Saulgau/Wurtt., 1985, pp. 118-119.
Technical Information Du Pont, Pyralux PC 1000, 2000.

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