Flexible cicuit substrate with electroconductive adhesive layer

Details Flexible cicuit substrate with electroconductive adhesive layer Flexible cicuit substrate with electroconductive adhesive layer

1985-12-12

1989-07-04

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

2041814, 156151, 428901, C25D 1312, C25D 1500, B32B 3112

Patent

active

048447846

ABSTRACT:
An electroconductive adhesive layer of high molecular weight resin having electroconductive particles disposed therein is electrodeposited selectively on only the electroconductive circuit povided on a flexible circuit substrate. The adhesive layer permits precise bonding of the coated circuit with an identical circuit provided on a second flexible circuit substrate.

REFERENCES:
patent: 3646670 (1972-03-01), Maeda et al.
patent: 3752751 (1973-08-01), Hirose
patent: 3892646 (1975-07-01), Lazzarini et al.
patent: 3945964 (1976-03-01), Hastings et al.
patent: 4157932 (1979-06-01), Hirato
patent: 4676854 (1987-06-01), Suzuki

Affiliated with

Also associated with

Rating

Flexible cicuit substrate with electroconductive adhesive layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible cicuit substrate with electroconductive adhesive layer , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible cicuit substrate with electroconductive adhesive layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-850591