Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-10-03
2006-10-03
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S700000, C257S686000, C257S692000
Reexamination Certificate
active
07115986
ABSTRACT:
A method and apparatus for increasing the integrated circuit density in a semiconductor assembly. The assembly includes a flexible interposer substrate attached to an active surface and a back side of a first die, the interposer substrate wrapping around at least one side of the first die. The assembly also includes an array of discrete conductive elements connected to bond pads of the first die through conductive traces and exposed on an exterior surface of the interposer substrate for effecting an external electrical connection. The assembly may include a second die facing the first die and attached to the interposer substrate, the interposer substrate being wrapped around either the first or second die or, alternatively, being wrapped around both the first and second die.
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patent: W
Koon Eng Meow
Moon Ow Chee
Clark S. V.
TraskBritt
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