Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-01-22
2008-01-22
Warren, Matthew E. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S664000, C257S668000, C257SE23177
Reexamination Certificate
active
07321167
ABSTRACT:
In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodiment, a coplanar waveguide design is provided.
REFERENCES:
patent: 4816967 (1989-03-01), Landis
patent: 5854534 (1998-12-01), Beilin et al.
patent: 6246112 (2001-06-01), Ball et al.
patent: 6249046 (2001-06-01), Hashimoto
patent: 6353189 (2002-03-01), Shimada et al.
patent: 6388198 (2002-05-01), Bertin et al.
patent: 6720502 (2004-04-01), Alcoe et al.
patent: 6803649 (2004-10-01), He et al.
patent: 2001/0010395 (2001-08-01), Ball et al.
patent: 2002/0171133 (2002-11-01), Mok et al.
patent: 2003/0198032 (2003-10-01), Collander et al.
patent: 2004/0061213 (2004-04-01), Karnezos
patent: 2005/0017327 (2005-01-01), Forbes et al.
Auernheimer Joel
He Jianggi
Kang Jung
Kim Hyunjun
Li Yuan-Liang
Intel Corporation
Schwabe Williamson & Wyatt P.C.
Warren Matthew E.
LandOfFree
Flex tape architecture for integrated circuit signal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flex tape architecture for integrated circuit signal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flex tape architecture for integrated circuit signal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2811878