Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2005-05-23
2008-09-09
Norris, Jeremy C. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000
Reexamination Certificate
active
07423219
ABSTRACT:
In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads.
REFERENCES:
patent: 5084961 (1992-02-01), Yoshikawa
patent: 5428190 (1995-06-01), Stopperan
patent: 5600103 (1997-02-01), Odaira et al.
patent: 6326555 (2001-12-01), McCormack et al.
patent: 6329610 (2001-12-01), Takubo et al.
patent: 6350365 (2002-02-01), Koyama et al.
patent: 6449836 (2002-09-01), Miyake et al.
patent: 6570098 (2003-05-01), Shimizu et al.
patent: 6703566 (2004-03-01), Shiraishi et al.
patent: 6713682 (2004-03-01), Hirahara et al.
patent: 6759600 (2004-07-01), Koyama et al.
patent: 2004/0016568 (2004-01-01), Palanisamy
patent: 2007/0012475 (2007-01-01), Kawaguchi et al.
patent: 2 294 363 (1996-04-01), None
patent: 59-145058 (1984-09-01), None
patent: 05 090756 (1993-04-01), None
patent: 6-45364 (1994-06-01), None
patent: 07 038222 (1995-02-01), None
patent: 07 170076 (1995-07-01), None
patent: 8-125342 (1996-05-01), None
patent: 8-335759 (1996-12-01), None
patent: 10-200256 (1998-07-01), None
patent: 10-256688 (1998-09-01), None
patent: 2000-133944 (2000-05-01), None
patent: 2001-251053 (2001-09-01), None
patent: 2001-267695 (2001-09-01), None
patent: 2001-284747 (2001-10-01), None
patent: 2001-339126 (2001-12-01), None
patent: 2003-110240 (2003-04-01), None
patent: 2003-238709 (2003-08-01), None
patent: 2004-63908 (2004-02-01), None
U.S. Appl. No. 10/546,298, filed Aug. 19, 2005, Kawaguchi, et al.
U.S. Appl. No. 10/558,289, filed Nov. 28, 2005, Kawaguchi et al.
U.S. Appl. No. 11/629,099, filed Dec. 11, 2006, Mikado, et al.
Futamura Hirofumi
Ito Sotarou
Kawaguchi Katsuo
Mikado Yukinobu
Ibiden Co. Ltd.
Norris Jeremy C.
Semenenko Yuriy
LandOfFree
Flex-rigid wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flex-rigid wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flex-rigid wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3969268