Flex circuit assembly

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S329000

Reexamination Certificate

active

07425135

ABSTRACT:
An assembly for coupling an electrical device with a rigid structure using a flex circuit is provided. The assembly includes a staple having posts which extend into the rigid structure and secure the staple to the rigid structure. The flex circuit couples with both the rigid structure and the electrical device. The flex circuit extends between the staple and the rigid structure such that the flex circuit couples with the rigid structure thereby providing an interconnection between the electrical device and the rigid structure.

REFERENCES:
patent: 3271214 (1966-09-01), Tabor
patent: 3629787 (1971-12-01), Wilson
patent: 3987676 (1976-10-01), Bennewitz
patent: 4092061 (1978-05-01), Stigliani, Jr.
patent: 4128697 (1978-12-01), Simpson
patent: 4162817 (1979-07-01), Briggs et al.
patent: 4295696 (1981-10-01), Gray
patent: 4375578 (1983-03-01), Mitchell et al.
patent: 4435031 (1984-03-01), Black et al.
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4769684 (1988-09-01), Crocker et al.
patent: 4818099 (1989-04-01), Preikschat et al.
patent: 4952016 (1990-08-01), Adams et al.
patent: 4953006 (1990-08-01), Kovats et al.
patent: 4962991 (1990-10-01), Carvalho
patent: 4973211 (1990-11-01), Potucek
patent: 5044980 (1991-09-01), Krumme et al.
patent: 5125054 (1992-06-01), Ackley et al.
patent: 5136682 (1992-08-01), Moyer et al.
patent: 5212345 (1993-05-01), Gutierrez
patent: 5249245 (1993-09-01), Lebby et al.
patent: 5253311 (1993-10-01), Killen et al.
patent: 5262590 (1993-11-01), Lia
patent: 5299276 (1994-03-01), Okamura et al.
patent: 5359686 (1994-10-01), Galloway et al.
patent: 5361317 (1994-11-01), Hartman et al.
patent: 5371820 (1994-12-01), Welbourn et al.
patent: 5371822 (1994-12-01), Horwitz et al.
patent: 5375184 (1994-12-01), Sullivan
patent: 5389686 (1995-02-01), Diop et al.
patent: 5414786 (1995-05-01), Ohta et al.
patent: 5420954 (1995-05-01), Swirhun et al.
patent: 5432630 (1995-07-01), Lebby et al.
patent: 5462441 (1995-10-01), Renn et al.
patent: 5471552 (1995-11-01), Wuu et al.
patent: 5474463 (1995-12-01), Robinson et al.
patent: 5495125 (1996-02-01), Uemura
patent: 5499312 (1996-03-01), Hahn et al.
patent: 5539848 (1996-07-01), Galloway
patent: 5545846 (1996-08-01), Williams et al.
patent: 5596662 (1997-01-01), Boscher
patent: 5613024 (1997-03-01), Shahid
patent: 5625734 (1997-04-01), Thomas et al.
patent: 5638469 (1997-06-01), Feldman et al.
patent: 5666449 (1997-09-01), Sawae et al.
patent: 5703895 (1997-12-01), Ghirardi et al.
patent: 5706378 (1998-01-01), Suzuki et al.
patent: 5717800 (1998-02-01), Funabashi
patent: 5733151 (1998-03-01), Edsall et al.
patent: 5752851 (1998-05-01), Zaderej et al.
patent: 5774614 (1998-06-01), Gilliland et al.
patent: 5894409 (1999-04-01), Tanaka
patent: 5974214 (1999-10-01), Shacklette et al.
patent: 6010359 (2000-01-01), Etters et al.
patent: 6011695 (2000-01-01), Dumke
patent: 6017222 (2000-01-01), Kao
patent: 6039600 (2000-03-01), Etters et al.
patent: 6040624 (2000-03-01), Chambers et al.
patent: 6045269 (2000-04-01), Watanabe et al.
patent: 6069991 (2000-05-01), Hibbs-Brenner et al.
patent: 6088498 (2000-07-01), Hibbs-Brenner et al.
patent: 6091475 (2000-07-01), Ogino et al.
patent: 6118666 (2000-09-01), Aoki et al.
patent: 6162065 (2000-12-01), Benham
patent: 6195261 (2001-02-01), Babutzka et al.
patent: 6268231 (2001-07-01), Wetzel
patent: 6294255 (2001-09-01), Suzuki et al.
patent: 6326553 (2001-12-01), Yim et al.
patent: 6380493 (2002-04-01), Morita et al.
patent: 6404960 (2002-06-01), Hibbs-Brenner et al.
patent: 6473314 (2002-10-01), Custer et al.
patent: 6485322 (2002-11-01), Branch et al.
patent: 6521989 (2003-02-01), Zhou
patent: 6537082 (2003-03-01), Hopfer et al.
patent: 6586678 (2003-07-01), Rosenberg et al.
patent: 6617518 (2003-09-01), Ames et al.
patent: 6703561 (2004-03-01), Rosenberg et al.
patent: 6709607 (2004-03-01), Hibbs-Brenner et al.
patent: 6767220 (2004-07-01), Wilson et al.
patent: 6769920 (2004-08-01), Mease et al.
patent: 6809905 (2004-10-01), Kilmer
patent: 6863453 (2005-03-01), Wang et al.
patent: 2002/0170742 (2002-11-01), Liaw et al.
patent: 2003/0102157 (2003-06-01), Rosenberg et al.
patent: 2003/0197254 (2003-10-01), Huang
patent: 2004/0018409 (2004-01-01), Hui et al.
patent: 2004/0062491 (2004-04-01), Sato et al.
patent: 2004/0090620 (2004-05-01), Farr
patent: 2004/0092135 (2004-05-01), Hofmesiter et al.
patent: 2005/0130488 (2005-06-01), Zhu et al.
patent: 0 881 671 (1998-12-01), None
patent: 0 905 838 (1999-03-01), None
patent: 61-071689 (1986-04-01), None
patent: 62/114545 (1987-05-01), None
patent: 63-136680 (1988-06-01), None
patent: 01-169986 (1989-05-01), None
patent: 02-240989 (1990-09-01), None
patent: 03-0148190 (1991-06-01), None
patent: 406034838 (1994-02-01), None
patent: 407159636 (1995-06-01), None
patent: 09-223848 (1997-08-01), None
patent: 92/00538 (1992-01-01), None
U.S. Appl. No. 10/409,837, filed Apr. 9, 2003, Kumar et al.
U.S. Appl. No. 10/835,832, filed Apr. 30, 2004, Kumar et al.
U.S. Appl. No. 10/836,728, filed Apr. 30, 2004, Ellison.
U.S. Appl. No. 10/687,107, Oct. 16, 2003, Aronson et al.
U.S. Appl. No. 10/836,129, filed Apr. 30, 2004, Nippa et al.
U.S. Appl. No. 11/179,223, filed Jul. 11, 2005, Ice.
Murata, S., Nishimura, K.,Improvement in Thermal Properties of a Multi-Beam Laser Diode Array, Japanese Journal of Applied Physics, vol. 28, Suppl. 28-3, pp. 165-170 (1989).
Ali, “New Materials and Design Components for Integrated Optics,” Technology Report/Fiberoptics, Laser Focus World, vol. 21, No. 8, Aug. 1985, Tulsa, U.S., pp. 48-50.
Cohen, “Passive Laser-Fiber Alignment by Index Method,” IEEE Photonics Technology Letters, vol. 3, No. 11, Dec. 1991, pp. 985-987, New York, U.S.
Coldren, et al., “Flip-Chip Bonded, Back-Emitting, Microlensed Arrays of Monolithic Vertical Cavity Lasers and Resonant Photodetectors,” Electronic Components and Technology Conference, Sep. 1999, pp. 733-740.
Havant, “Flexible Interposing Carrier Scheme for Optical Waveguides,” Research Disclosure No. 303, Jul. 1989, p. 512.
Hibbs-Brenner, et al., “Packaging of VCSEL Arrays for Cost-Effective Interconnects at <10 Meters,” Electronic Components and Technology Conference, Sep. 1999, pp. 747-752.
Hsu, et al., “Flip-chip Approach to Endfire Coupling Between Single-Mode Optical Fibres and Channel Waveguides,” Patent Associates Literature, Electronic Letters, vol. 12, No. 16, pp. 404-405, Aug. 5, 1976.
Kazlas, et al., “Monolithic Vertical-Cavity Laser/p-i-n Photodiode Transceiver Array for Optical Interconnects,” IEEE Photonics Technology Letters, Nov. 1998, pp. 1530-1532, vol. 10, No. 11.
Louderback, et al., “Flip Chip Bonded Arrays of Monolithically Integrated, Microlensed Vertical-Cavity Lasers and Resonant Photodetectors,” IEEE Photonics Technology Letters, Mar. 1999, pp. 304-306, vol. II, No. 3.
Plawsky, et al., “Photochemically Machined, Glass Ceramic, Optical Fiber Interconnection Components,” Article, Optoelectronic Materials, Devices, Packaging and Interconnects (1998), SPIE, vol. 994, pp. 101-106.
Sullivan, et al., “Polymeric Waveguides,” 1992 IEEE, pp. 27-31.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flex circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flex circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flex circuit assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3992802

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.