Flatpack for hermetic encapsulation of piezoelectric components

Details Flatpack for hermetic encapsulation of piezoelectric components Flatpack for hermetic encapsulation of piezoelectric components

1986-11-06

1988-05-03

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

310340, 357 73, H05K 506

Patent

active

047421827

ABSTRACT:
A flatpack package for hermetic encapsulation of piezoelectronic components, which flatpack is suitable for use in efficient and automated surface mounting (SMT). The flatpack package consists of a base plate, a cover plate and a mounting unit of two support frames between which are placed lamellar connecting leads leading into the package. The leads serve both for mechanical holding of the quartz resonator disk and as the electrical connection thereof. All the package parts are produced from glass, are connected to one another by using solder glass as a sealing material. The parts are dilathermally matched with one another.

REFERENCES:
patent: 4110655 (1978-08-01), Hata et al.
patent: 4293986 (1981-10-01), Kobayashi et al.
patent: 4362961 (1982-12-01), Gerber

Affiliated with

Also associated with

Rating

Flatpack for hermetic encapsulation of piezoelectric components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flatpack for hermetic encapsulation of piezoelectric components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flatpack for hermetic encapsulation of piezoelectric components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1507465