Flatness and throughput of single side polishing of wafers

Details Flatness and throughput of single side polishing of wafers Flatness and throughput of single side polishing of wafers

1997-10-31

2000-06-27

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451291, B24B 100

Patent

active

060800429

ABSTRACT:
A wafer polishing apparatus includes one or more wafer carriers each containing one or more wafers mounted on both sides of the carrier. Upper and lower turntables having upper and lower polishing surfaces, rotate to polish the wafers attached to the carriers. Hence, wafers on the top of the carriers, and wafers on the bottom of the carriers are polished simultaneously. This configuration increases throughput; also, thermal deformations in the wafers are reduced, thus improving flatness.

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