Flatline method of drying wafers

Details Flatline method of drying wafers Flatline method of drying wafers

1995-02-14

1996-06-11

Kwon, John T.

Drying and gas or vapor contact with solids

Process

Gas or vapor contact with treated material

34500, F26B 300

Patent

active

055243614

ABSTRACT:
Drying of particulate materials, such as wood chips (wafers/strands) for the manufacture of oriented structural board, as well as bark, and the like. The method is characterized by advancing wafers in random array and superposed and without contact above a planar surface; forcing heated air upwardly through spaced apart holes defined in the stationary planar surface and through the random array of advancing wafers, while evacuating heated air and accumulated moisture above the advancing wafers. The method is distinguished by lateral shielding during forcing of heated air above the planar surface, so as to inhibit "blow-holes" among the drying wafers.

REFERENCES:
patent: 2057681 (1936-10-01), Harrington
patent: 2336698 (1943-12-01), Morrill
patent: 2346176 (1944-04-01), McAleer
patent: 4206553 (1980-06-01), Ellison et al.
patent: 4338079 (1982-07-01), Faulkner et al.
patent: 4658513 (1987-04-01), Strattman
patent: 5341580 (1994-08-01), Teal

Affiliated with

Also associated with

Rating

Flatline method of drying wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flatline method of drying wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flatline method of drying wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-345704