Flat-type semiconductor device and packing thereof

Details Flat-type semiconductor device and packing thereof Flat-type semiconductor device and packing thereof

1982-03-10

1984-11-20

Dixson, Jr., William T.

Special receptacle or package

For a building component

Shingle

206499, 206334, B65D 8562, B65D 7302, H05K 500, B65B 108

Patent

active

044834411

ABSTRACT:
A packing for transporting flat-type semiconductor devices which prevents deformation of the lead wires and which improves the transportation efficiency, and a flat-type semiconductor which is particularly suitable for the packing. A flat-type semiconductor device to be used for the packing of the present invention has a protection frame which is partially fixed to a hermetic package sealing a semiconductor element and which protects lead wires. The semiconductor devices are stacked in a container having a bottom. A lid is placed on the semiconductor devices to complete the packing of the present invention. In order to facilitate the removal of the protection frame by the user, the protection frame of the flat-type semiconductor device is fixed to the hermetic package at one side each of four corners.

REFERENCES:
patent: 3454154 (1969-07-01), Peters et al.
patent: 3550766 (1970-12-01), Nixen
patent: 3604557 (1971-09-01), Cedrone
patent: 3892312 (1975-07-01), Tems
patent: 4043485 (1977-08-01), Tippetts
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4359157 (1982-11-01), Horstmann

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