Flat transponder and method for the production thereof

Details Flat transponder and method for the production thereof Flat transponder and method for the production thereof

2011-06-28

2011-06-28

Lee, Seung H (Department: 2887)

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Conductive

Reexamination Certificate

active

07967213

ABSTRACT:
The invention relates to a flat transponder having an electronic circuit which is arranged in a layer or in a layer composite and which contains at least one chip and conductor tracks or conductor wires, and also to a method for the production thereof. The invention is based on the object of specifying a transponder of the type mentioned at the beginning and a method for the production thereof which is flexible, has the most uniform thickness possible and can be bonded to further elements by means of water-based adhesives, its electronic components largely being protected against damage by bending and against being detected by feel. According to the invention, the object is achieved by a transponder in which the circuit is arranged in or on a circuit carrier (7) made of plastic, on whose two larger opposite outer surfaces a paper layer (6) applied by lamination is in each case applied.

REFERENCES:
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patent: 5936227 (1999-08-01), Truggelmann et al.
patent: 6879258 (2005-04-01), Kuroda et al.
patent: 2001/0040186 (2001-11-01), Okada
patent: 2003/0132302 (2003-07-01), Hattori
patent: 2003/0197064 (2003-10-01), Saint et al.
patent: 1130542 (2001-09-01), None
patent: 2000155821 (2000-06-01), None
German Office Action, Patent Application No. 05 742 940.9-1248, Feb. 20, 2008, 4 pgs.
International Search Report dated Jul. 28, 2005, for PCT Application No. PCT/DE2005/000452.

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