Flat portions of a probe card flattened to have same...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S757020

Reexamination Certificate

active

07394265

ABSTRACT:
A probe card on which micro probe needles are arranged at high density and with high precision without need of a complicated structure or variation in needle height. A probe card1installed in a wafer tester includes a board2having a wiring pattern for transmitting a test signal to be impressed on a wafer under test, a built-up board10formed on the surface of the board2, a comb-shaped silicon-made probe needle20arranged on the built-up board10and connected to the surface wiring pattern11, and a flat portion12formed by plating on the surface wiring pattern11on the built-up board10and having a surface flattened by polishing. The probe needle20is loaded on the flat portion12and thus mounted on the board2.

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