Flat plate heat pipe cooling system for electronic equipment enc

Details Flat plate heat pipe cooling system for electronic equipment enc Flat plate heat pipe cooling system for electronic equipment enc

1998-04-15

2000-11-21

Lazarus, Ira S.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510426, 165185, 361687, 361700, 361704, 174 152, 257715, F28D 1500

Patent

active

061489069

ABSTRACT:
A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.

REFERENCES:
patent: 3834457 (1974-09-01), Madsen
patent: 4046190 (1977-09-01), Marcus et al.
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5579830 (1996-12-01), Giammaruti
patent: 5588483 (1996-12-01), Ishida
patent: 5621613 (1997-04-01), Haley et al.
patent: 5642775 (1997-07-01), Akachi
patent: 5646822 (1997-07-01), Bhatia et al.
patent: 5694295 (1997-12-01), Mochizuki et al.
patent: 5697428 (1997-12-01), Akachi
patent: 5725050 (1998-03-01), Meyer, IV et al.
patent: 5781409 (1998-07-01), Mecredy, III
patent: 5796581 (1998-08-01), Mok
patent: 5822187 (1998-10-01), Garner et al.
patent: 5832987 (1998-11-01), Lowry et al.
patent: 5847925 (1998-12-01), Progi et al.
patent: 5880929 (1999-03-01), Bhatia
patent: 5910883 (1999-06-01), Cipolla et al.

Affiliated with

Also associated with

Rating

Flat plate heat pipe cooling system for electronic equipment enc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flat plate heat pipe cooling system for electronic equipment enc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flat plate heat pipe cooling system for electronic equipment enc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1249001