Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only
Reexamination Certificate
2001-10-17
2003-04-08
Ton, Toan (Department: 2871)
Liquid crystal cells, elements and systems
Particular structure
Having significant detail of cell structure only
C349S150000
Reexamination Certificate
active
06545737
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a flat panel display device such as a liquid crystal display device and a manufacturing method thereof.
2. Description of the Prior Art
A conventional liquid crystal display module production method will be described with reference to drawings of production process shown in FIG.
10
.
After a liquid crystal cell
102
is produced, anisotropic conductive film (hereinafter referred to as ACF) is bonded along an edge portion of the liquid crystal cell
102
.
This bonded ACF is heated by a heating means
103
and a tape carrier package (hereinafter referred to as TCP) is temporarily press-fit.
After that, this TCP
104
is heated again from up so as to press-fit the TCP
104
to the liquid crystal cell
102
.
Next, the ACF
112
is bonded to a printed circuit board (hereinafter referred to as PCB)
106
.
Finally, the positions of the plurality of the TCPs
104
attached to the liquid crystal cell
102
are matched with that of the PCB
106
to be mounted thereon and then the PCB
106
and the TCPs
104
are bonded together with the ACF
112
and fixed.
The above mentioned bonding process for bonding the ACF
112
to the PCB
106
has a following first problem.
On a back side of the PCB
106
is already formed a wiring structure
115
such as a copper (Cu) wiring pattern and IVH (interstitial via hole) or a printed pattern by silk screen for indicating PCB serial number. Therefore, a quite number of unevenness are formed on the back side of the PCB
106
.
However, the bonding of the ACF
112
is carried out by hands of a worker by visually checking a position of the land group so that the ACF
112
covers a region confirmed by him.
Therefore, the conventional art has the following problems.
(1) First, it is very difficult to secure a bonding position accuracy for the ACF
112
, and if it is intended to improve the position accuracy, even a skilled worker needs a sufficient working time. To reduce a working load, it can be considered to ensure a large dimensional margin. However, this does not only lead to increase of production cost, but also conflicts with a demand for narrowing of the frame edge.
(2) As shown in
FIG. 12
, upon thermo compression bonding, a back side of a terminal connecting portion to which a heat tool
120
is to be applied is covered partly with a printed pattern having a quite thickness such as a wiring pattern
115
. Thus, sometimes, a pressing force by the heat tool
120
is not applied equally or sometimes heating is not carried out equally, so that there is a fear that a connection failure may occur in part of the terminals. If the connecting reliability is intended to be secured sufficiently, a time and pressure for thermo compression bonding need to be set to be larger than values originally necessary. Thus, a necessary process load will be increased.
In the process for matching the positions of the TCP
104
and PCB
106
, the following second problem exists.
FIG. 13
is a further detailed explanatory view as viewing a case in which the position matching between the TCP
104
and PCB
106
is carried out, through a plan. That is, this figure shows a condition that the position of the TCP
104
fixed to the edge of the liquid crystal
102
is matched with that of the lands
110
of the PCB
106
.
If the position of the TCP
104
is matched with that of the PCB
106
in the above production process, as shown in
FIG. 13
, the liquid crystal cell
102
is fixed to a first jig
114
and on the other hand, the PCB
106
is installed on a second jig
116
, and the positions of the jigs
114
,
116
are matched. Then, the positions of the TCP
104
and PCB
106
are matched with each other.
However, if the above described method for matching the positions of the TCP
104
and PCB
106
is applied, the limit of the gap e between leads
108
of the TCP
104
is 0.5 mm and the position matching with a finer pitch cannot be carried out.
SUMMARY OF THE INVENTION
Accordingly, the present invention has been achieved in views of the above problems and therefore, a first object of the invention is to provide a flat panel display device capable of improving a position accuracy when an ACF is provided so as to obtain electrical and mechanical connections. Further, a second object of the invention is to provide a manufacturing method of a flat panel display device enabling to match the position of a flexible wiring board having leads having a finer pitch with that of a land of a printed circuit board.
To achieve the above object, according to a first aspect of the present invention, there is provided a flat panel display device comprising: a display panel in which a plurality of display picture elements are disposed; a first wiring board one end of which is connected electrically to the display panel and provided with a first terminal group at the other end thereof; and a second wiring board provided with a second terminal group corresponding to the first terminal group at a main surface thereof, electrically connected to the first terminal group through an anisotropic conductive film, for outputting a control signal to the display panel, the second wiring board having position indicating marks for indicating a disposition position of the anisotropic conductive film.
According to a second aspect of the present invention, there is provided a manufacturing method of a flat panel display device comprising: a display panel in which a plurality of display picture elements are disposed; a flexible electrode substrate having a plurality of leads to be connected electrically to the display panel; and a wiring board having a plurality of lands corresponding to the leads of the flexible electrode substrates and for supplying a control signal to the display panel, the manufacturing method comprising the steps of: disposing the leads of the flexible electrode substrate and the lands of the wiring board such that they oppose; irradiating with light having a light axis inclined at an angle smaller than 90° relative to an axis line of the lead; and detecting relative positions of the leads and the lands irradiated by the light and matching positions thereof by a picture detecting portion disposed above the leads.
According to a third aspect of the present invention, there is provided a flat panel display device wherein a connecting region at an end of a lead of a flexible substrate mounted on a display panel is connected to lands on a top surface of a wiring board via an anisotropic conductive film, the lands of the wiring board being longer than the connecting region of the lead of the flexible substrate.
According to a fourth aspect of the present invention, there is provided a flat panel display device wherein a connecting region at an end of a lead of a flexible substrate mounted on a display panel is connected to lands on a top surface of a wiring board via an anisotropic conductive film, the lands of the wiring board being longer than a width of the anisotropic conductive film.
According to a fifth aspect of the present invention, there is provided a manufacturing method of a flat panel display device comprising: a display panel; a flexible electrode substrate having a plurality of leads to be electrically connected to the display panel; and a wiring board having a plurality of lands corresponding to the lead of the flexible substrate and for supplying a control signal to the display panel, the manufacturing method comprising the steps of: disposing the anisotropic conductive film on the wiring board following position indicating marks provided on the wiring board to indicate a wiring position of the anisotropic conductive film;
disposing the leads of the flexible substrate and the lands of the wiring board such that they oppose; irradiating with light having a light axis inclined at an angle smaller than 90° relative to an axis line of the lead; detecting relative positions of the leads and the lands irradiated by the light and matching positions thereof by a picture detecting portion disposed above
Hasegawa Tatsuya
Ito Yoshihiro
Ohkubo Masaichi
Tokunaga Sanae
Kabushiki Kaisha Toshiba
Ton Toan
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