Flat package semiconductor device having high explosion preventi

Details Flat package semiconductor device having high explosion preventi Flat package semiconductor device having high explosion preventi

1977-10-20

1979-04-17

James, Andrew J.

357 72, 357 79, 357 81, H01L 2302, H01L 2312, H01L 2328

Patent

active

041503945

ABSTRACT:
A semiconductor element is disposed within a hollow cylindrical, electrically insulating member. The member has each of opposite open ends closed with a respective electrode of the element and a piece of thin sheet metal to form an annular space on either side of the semiconductor element. A silicone rubber layer is attached to that surface of the metallic piece facing the semiconductor element, and a high thermally resisting ceramic annulus is buried in the layer.

REFERENCES:
patent: 3566958 (1971-03-01), Zelina
patent: 3581160 (1971-05-01), Piccone
patent: 3651383 (1972-03-01), Livezey
patent: 3721867 (1973-03-01), Schierz
patent: 3975758 (1976-08-01), Schlegel
patent: 3992717 (1976-11-01), Rice
patent: 4008486 (1977-02-01), Byczkowski

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