Flat mount with at least one semiconductor chip

Details Flat mount with at least one semiconductor chip Flat mount with at least one semiconductor chip

2005-02-01

2005-02-01

Vigushin, John B. (Department: 2827)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S737000, C361S783000, C257S679000, C235S492000

Reexamination Certificate

active

06850420

ABSTRACT:
The flat mount assembly, or transponder, has at least one semiconductor chip that is connected to an antenna for interchanging data and power with an electronic apparatus. The antenna is formed of two electrical conductors. A conductive layer is formed on the mount in overlapping relationship with the electrical conductors of the antenna. The overlapping conductive layer results in greater capacitive coupling between the electronic apparatus and the flat mount assembly.

REFERENCES:
patent: 3967161 (1976-06-01), Lichtblau
patent: 4656478 (1987-04-01), Leuenberger
patent: 6043745 (2000-03-01), Lake
patent: 6111506 (2000-08-01), Yap et al.
patent: 6563425 (2003-05-01), Nicholson et al.
patent: 6622921 (2003-09-01), Altwasser et al.
patent: 196 01 358 (1996-07-01), None
patent: 0 019 191 (1980-11-01), None
patent: 0 905 657 (1999-03-01), None
patent: 2 097 881 (1997-11-01), None

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