Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2006-10-26
2010-10-26
Enad, Elvin G (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
C336S222000, C336S223000, C336S232000, C336S233000, C336S083000, C428S928000, C428S357000, C148S304000, C252S06251C, C252S062550
Reexamination Certificate
active
07821371
ABSTRACT:
A planar magnetic device1including a first magnetic layer3, a second magnetic layer5, and a planar coil4disposed between the first magnetic layer3and the second magnetic layer5, wherein magnetic particles7having a shape ratio S/L of 0.7 to 1 when a length of a long axis is L and a length of a short axis orthogonal to the long axis is L are filled in a gap W between coil wirings of the planar coil4. According to the planar magnetic device1, it is possible to realize a planar magnetic device such as an inductor reduced in height by using fine particles that enable to effectively obtain a large inductance value.
REFERENCES:
patent: 6091310 (2000-07-01), Utsumi et al.
patent: 6414564 (2002-07-01), Mizoguchi et al.
patent: 6888435 (2005-05-01), Inoue et al.
patent: 7064643 (2006-06-01), Matsutani et al.
patent: 7422697 (2008-09-01), Takahashi et al.
patent: 2005/0030725 (2005-02-01), Galvagni et al.
patent: 2005/0072955 (2005-04-01), Takahashi et al.
patent: 2005/0190036 (2005-09-01), Uriu et al.
patent: 2006/0152321 (2006-07-01), Jung et al.
patent: 2006/0170524 (2006-08-01), Fujiwara et al.
patent: 2008/0008897 (2008-01-01), Imagawa et al.
patent: 2008/0248245 (2008-10-01), Maeda et al.
patent: 1321991 (2001-11-01), None
patent: 5 275247 (1993-10-01), None
patent: 2002 299120 (2002-10-01), None
patent: 2002 299122 (2002-10-01), None
patent: 2002 353030 (2002-12-01), None
patent: 2003 17322 (2003-01-01), None
Inoue Tetsuo
Nakagawa Katsutoshi
Sato Akira
Enad Elvin G
Kabushiki Kaisha Toshiba
Lian Mangtin
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Toshiba Materials Co., Ltd.
LandOfFree
Flat magnetic element and power IC package using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flat magnetic element and power IC package using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flat magnetic element and power IC package using the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4238611