Flash memory having insulating liners between source/drain...

Static information storage and retrieval – Floating gate – Particular connection

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C365S185020, C365S210130, C365S042000, C365S042000

Reexamination Certificate

active

07668010

ABSTRACT:
A memory array comprises a semiconductor body having a plurality of trenches aligned generally in parallel. The trenches contain semiconductor material, such as doped amorphous silicon, and act as source/drain lines for the memory array. Insulating liners lie between the semiconductor material within the trenches and the semiconductor body. A plurality of word lines overlie the plurality of trenches and channel regions in the semiconductor body in an array of cross points. Charge trapping structures lie between the word lines and the channel regions at the cross points, providing an array of flash memory cells. The charge trapping structures comprise dielectric charge trapping structures adapted to be programmed and erased to store data. A method for manufacturing such devices includes patterning and forming the sources/drain lines with insulating liners prior to formation of the charge trapping structure over the channel regions.

REFERENCES:
patent: 4963502 (1990-10-01), Teng et al.
patent: 5258634 (1993-11-01), Yang
patent: 5859459 (1999-01-01), Ikeda
patent: 5896311 (1999-04-01), Wen
patent: 6368928 (2002-04-01), Wang et al.
patent: 6380045 (2002-04-01), Guo et al.
patent: 6627943 (2003-09-01), Shin et al.
patent: 6812103 (2004-11-01), Wang et al.
patent: 6858505 (2005-02-01), Park
patent: 6933565 (2005-08-01), Matsumoto et al.
patent: 7176097 (2007-02-01), Hiraizumi et al.
patent: 2008/0296659 (2008-12-01), Park et al.
patent: 466704 (2001-01-01), None
patent: I255553 (2006-05-01), None
Park, Youngwoo et al., “Highly Manufacturable 32Gb Multi-Level NAND Flash Memory with 0.0098 μm2 Cell Size Using TANOS (Si-Ocide-Al2O3-TaN) Cell Technology,” Electron Devices Meeting, 2006. IEDM '06. International Dec. 11-13, 2006 pp. 1-4.
Jurczak, M., et al., “Dielectric pockets—a new concept of the junctions for deca-nanometric CMOS devices,” Solid-State Device Research Conference, 2000. Proceedings of the 30th European Sep. 11-13, 2000, pp. 536-539.
Trivedi, V.P., et al., “Nanoscale FD/SOI CMOS: Thick or Thin Box?” IEEE Electron Letters, vol. 26, No. 1, Jan. 2005, 3 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flash memory having insulating liners between source/drain... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flash memory having insulating liners between source/drain..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flash memory having insulating liners between source/drain... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4159697

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.