Flash memory device and method of fabricating the same

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

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C438S692000, C438S700000, C438S426000, C438S427000, C257SE21332, C257SE21209, C257SE21422

Reexamination Certificate

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07932159

ABSTRACT:
The present invention relates to flash memory devices and a method of fabricating the same. In an aspect of the present invention, the flash memory device includes trenches formed in a semiconductor substrate and having a step at their lower portion, a tunnel insulating layer formed in an active region of the semiconductor substrate, first conductive layers formed on the tunnel insulating layer, an isolation layer gap-filling between the trenches and the first conductive layers, and a second conductive layer formed on the first conductive layer and having one side partially overlapping with the isolation layers.

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patent: 7402886 (2008-07-01), Yuan
patent: 7855409 (2009-08-01), Dong
patent: 2003/0001204 (2003-01-01), Kobayashi
patent: 2006/0270181 (2006-11-01), Sandhu et al.
patent: 2008/0268608 (2008-10-01), Kim et al.
patent: 1591837 (2005-03-01), None
patent: 10-2000-0045372 (2000-07-01), None
patent: 10-2006-0005062 (2006-01-01), None
patent: 10-2007-0055716 (2007-05-01), None
patent: 10-2007-0064835 (2007-06-01), None
Translation of the First Office Action for corresponding Chinese Patent Application No. 200810132034.0, dated Jan. 22, 2010.

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