Flame retardant pressure-sensitive adhesives and tapes

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428356, 428352, 428921, 523179, 524415, 524416, B32B 712, B32B 1504, C08K 332

Patent

active

058516638

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

This invention relates to pressure-sensitive adhesive compositions containing non-halogen intumescent flame retardant (NHIFR) additives and to flame retardant pressure-sensitive adhesive tapes.


BACKGROUND OF THE INVENTION

Pressure-sensitive adhesives find use in a wide variety of applications, such as the automotive, aerospace, construction and electrical markets, either in the form of tapes or as adhesive coatings on other backings. For many of these applications, good flame retardant properties are of considerable importance. This performance has generally been achieved by means of the incorporation of halogenated, often brominated flame retardant additives into the adhesive formulation, as disclosed for example, in U.S. Pat. No. 4,061,826. Although efficient as flame retardants, these types of materials have considerable drawbacks in terms of smoke production and toxicity concerns, relating both to combustion products and also to disposal of the compounds themselves. Hence, there is considerable momentum towards the reduction in use or replacement of these flame retardants by zero halogen alternatives.
A further limitation of the use of halogenated flame retardants in pressure-sensitive adhesives is that during combustion they emit larger amounts of corrosive smoke. Combustion products of halogen containing materials, in particular HCl and HBr, contribute significantly to these effects. The corrosivity of smoke is of particular importance in electrical/electronic applications, since a small fire involving halogenated insulation materials may generate sufficient corrosive combustion products to cause widespread damage to other equipment not directly involved in the fire.
It has been suggested there is a synergistic interaction between phosphorus based and halogenated flame retardant additives. However, a detailed review on this subject (Weil, Ph.D., in Flame retardancy of polymeric materials, eds. W. C. Kuryla and A. J. Papa, pp. 185ff, Marcel Dekker, N.Y., 1975) concludes that the evidence for phosphorus halogen synergism is too weak to call for any explanation.
NHIFR materials have been used in adhesives, but the majority of the systems disclosed do not comprise pressure-sensitive adhesives.
Known adhesives having flame retardants are commonly based upon epoxy resins e.g. JP 70108692 (Nitto Koseki KK) which describes the use of nitrogen containing phosphates such as melamine phosphate in epoxy adhesives, or polyurethanes e.g. U.S. Pat. No. 5,010,113 (Blount) which describes the use of urea-phosphoric acid salts as flame retardants for flexible polyurethane foams, with adhesives as one suggested application.
U.S. Pat. No. 4,496,685 (Sumitomo Chemical KK) discloses the use of a variety of phosphazenes in cyanoacrylate adhesives. Although flame retardant behavior is mentioned as an issue, the main focus of the disclosure is directed towards the stabilization properties of the phosphazenes resulting in improved storage stability of the resins.
SU 789556 (Channova) describes fire resistant adhesives consisting of butyl acrylate methacrylic acid copolymers with a mixture of borax, boric acid and ammonium phosphate as the fire retardant. However, the adhesives are not pressure-sensitive adhesives.
The prior art does not disclose flame retardant pressure-sensitive adhesive compositions.


SUMMARY OF THE INVENTION

According to one aspect of the present invention there is provided a pressure-sensitive adhesive composition containing a non-halogen intumescent flame retardant.


BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are graphical representations of rate of heat release data for compositions of the present invention.
FIGS. 3 and 4 are graphical representations of specific extinction area data for compositions of the present invention.
FIGS. 5 and 6 are graphical representations of carbon monoxide yield data for compositions of the present invention.


DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The pressure-sensitive adhesive compositions may be based on a wide variety

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