Flame retardant polyetherimide resin composition with...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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C525S425000, C525S433000

Reexamination Certificate

active

06310145

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to thermoplastic polyetherimide resin compositions that exhibit flame retardant properties.
BRIEF DESCRIPTION OF THE RELATED ART
Polyetherimide resins exhibit certain physical properties, such as, for example, high strength at elevated temperature, that make them appropriate for use in high temperature applications. Certain applications, such as aircraft cabin interior components, require flame retardant properties in addition to resistance to elevated temperatures.
Flame resistant polymer blends that contain a polyetherimide resin, a polycarbonate resin and a siloxane polyetherimide copolymer are disclosed in coassigned U.S. Pat. No. 5,051,483.
While the polymer blends disclosed in the '483 patent were found to meet the flammability requirements applicable to aircraft interior components, polyetherimide resin compositions that provide improved flame retardant properties or that provide improved flame retardant properties at reduced cost are desired.
SUMMARY OF THE INVENTION
The present invention is directed to a thermoplastic resin composition comprising:
(a) a polyetherimide resin;
(b) an aromatic polycarbonate resin; and
(c) an amount of a functionalized polysiloxane polymer that is effective to improve the flame retarding properties of the thermoplastic resin composition.
The thermoplastic resin composition of the present invention exhibits high strength at elevated temperatures, good impact resistance and improved flame retardant properties.
DETAILED DESCRIPTION OF THE INVENTION
In a preferred embodiment, the thermoplastic resin composition comprises, based on 100 pbw of the combined polyetherimide resin and aromatic polycarbonate resin, from 60 to 90 pbw, more preferably from 70 to 80 pbw, of the polyetherimide resin, from 10 to 40 pbw, more preferably from 20 to 30 pbw, of the aromatic polycarbonate resin and from 0.1 to 4 pbw, more preferably from 0.2 to 1 pbw, of the functionalized polysiloxane polymer.
In a preferred embodiment, the thermoplastic resin composition consists essentially of the polyetherimide resin, the aromatic polycarbonate resin and the functionalized polysiloxane polymer.
Polyetherimide resins suitable for use as the polyetherimide resin component of the thermoplastic resin of the composition of the present invention are known compounds whose preparation and properties have been described, see generally, U.S. Pat. Nos. 3,803,085 and 3,905,942, the respective disclosures of which are incorporated herein by reference.
In a preferred embodiment, the polyetherimide resin component of the present invention contains from greater than 1 to 1000 or more, preferably from 10 to 1000, structural units of the formula (I):
wherein the divalent T moiety bridges the 3,3′, 3,4′, 4,3′, or 4,4′ positions of the aryl rings of the respective aryl imide moieties of formula (I); T is —O— or a group of the formula —O—Z—O—; Z is a divalent radical selected from the group consisting of formulae (II):
wherein X is a member selected from the group consisting of divalent radicals of the formulae (III):
wherein y is an integer from 1 to about 5, and q is 0 or 1; R is a divalent organic radical selected from the group consisting of: (a) aromatic hydrocarbon radicals having from 6 to about 20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals having from 2 to about 20 carbon atoms, (c) cycloalkylene radicals having from 3 to about 20 carbon atoms, and (d) divalent radicals of the general formula (IV):
where Q is a member selected from the group consisting of formulae (V):
where y′ is an integer from about 1 to about 5.
In one embodiment, the polyethermide resin may be a copolymer which, in addition to the etherimide units described above, further contains polyimide repeating units of the formula (VI):
wherein R is as previously defined for formula (I) and M is selected from the group consisting of formula (VII):
formula (VIII):
and formula (IX):
Polyetherimide resins are made by known methods, such as, for example, those disclosed in U.S. Pat. Nos. 3,847,867, 3,814,869, 3,850,885, 3,852,242, 3,855,178 and 3,983,093, the disclosures of which are hereby incorporated herein by reference.
In a preferred embodiment, the polyetherimide resin is made by the reaction of an aromatic bis(ether anhydride) of the formula (X):
with an organic diamine of the formula (XI):
H
2
N—R—NH
2
  (XI)
wherein T and R are defined as described above in formula (I). In general the reactions can be carried out employing well-known solvents, for example, o-dichlorobenzene, m-cresol/toluene and the like to effect interaction between the anhydride of formula (X) and the diamine of formula (XI), at temperatures from about 100° C. to about 250° C. Alternatively, the polyethermide resin can be prepared by melt polymerization of aromatic bis(ether anhydride)s and diamines accomplished by heating a mixture of the ingredients at elevated temperatures with concurrent stirring. Generally melt polymerizations employ temperatures between about 200° C. and 400° C. Chain stoppers and branching agents may also be employed in the reaction.
Examples of specific aromatic bis(ether anhydrides) and organic diamines are disclosed, for example, in U.S. Pat. Nos. 3,972,902 and 4,455,410, which are incorporated by reference herein.
Illustrative examples of aromatic bis(ether anhydride)s of formula (X) include: 2,2-bis(4-(3,4-dicarboxyphenoxy)phenyl)propane dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl ether dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)benzophenone dianhydride; 4,4′-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride; 2,2-bis([4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride; 4,4′-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride; 4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4′-bis(2,3-dicarboxyphenoxy)benzophenone dianhydride; 4,4′-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride; 4-(2,3-dicarboxyphenoxy)-4′-3,4-dicarboxyphenoxy)diphenyl-2,2-propane dianhydride; 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl ether dianhydride; 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)benzophenone dianhydride and 4-(2,3-dicarboxyphenoxy)-4′-(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride, as well as various mixtures thereof.
A preferred class of aromatic bis(ether anhydride)s included by formula (X) above includes compounds wherein T is of the formula (XII):
wherein each Y is independently selected from the group consisting of: formulae (XIII):
When polyetherimide/polyimide copolymers are employed, a dianhydride, such as pyromellitic anhydride, is used in combination with the bis(ether anhydride).
The bis(ether anhydride)s can be prepared by the hydrolysis, followed by dehydration, of the reaction product of a nitro substituted phenyl dinitrile with a metal salt of dihydric phenol compound in the presence of a dipolar, aprotic solvent.
Suitable organic diamines of formula (XI) include, for example: m-phenylenediamine; p-phenylenediamine; 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylmethane (commonly named 4,4′-methylenedianiline); 4,4′-diaminodiphenyl sulfide; 4,4′-diaminodiphenyl sulfone; 4,4′-diaminodiphenyl ether (commonly named 4,4′-oxydianiline); 1,5-diaminonaphthalene; 3,3-dimethylbenzidine; 3,3-dimethoxybenzidine; 2,4-bis(beta-amino-t-butyl)toluene; bis(p-beta-amino-t-butylphenyl)ether; bis(p-beta-methyl-o-aminophenyl)benzene; 1,3-diamino-4-isopropylbenzene; 1,2-bis(3-aminopropoxy)ethane; benzidine; m-xylylenediamine; 2,4-diaminotoluene; 2,6-diaminotoluene; bis(4-aminocyclohexyl)methane; 3-methylheptamethylenediamine; 4,4-dimethylheptamethylenediamine; 2,11-dodecanediamine; 2,2-dimethylpropylenediamine; 1,18-octamethylenediamine; 3-methoxyhexamethylenediamine; 2,5-dimethylhexameth

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