Flame-retardant heat-resistant resin composition and...

Stock material or miscellaneous articles – Composite – Of polyimide

Reexamination Certificate

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C428S3550EP, C428S413000, C428S474400, C523S451000, C525S423000, C525S533000

Reexamination Certificate

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07320830

ABSTRACT:
The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant resin composition, exerts a storage elastic modulus of 700 MPa or less, a coefficient of thermal expansion of 5×10−3/K or less and an internal stress of 20 MPa or less, in a temperature range of 25 to 250° C., and the present invention also relates to an adhesive film using the resin composition.

REFERENCES:
patent: 10-338747 (1998-12-01), None
patent: 11-217503 (1999-08-01), None
patent: 11-263840 (1999-09-01), None
patent: 2000-345035 (2000-12-01), None
patent: 2001-139809 (2001-05-01), None
patent: 2001-152016 (2001-06-01), None
patent: 2002-161205 (2002-06-01), None
patent: 1993-0007700 (1993-08-01), None
Machine translation of JP 2002-161205, provided by the JPO website.
Machine translation of JP 2001-139809, provided by the JPO website.
Official Action dated Feb. 20, 2007, for JP 2003-526998.

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