Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2006-08-29
2006-08-29
Sellers, Robert (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C523S427000, C523S457000, C523S466000
Reexamination Certificate
active
07098276
ABSTRACT:
An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1≦E≦0.27 W+21.8 in the case of 30≦W<60, or a value satisfying 0.30 W−13≦E≦3.7 W−184 in the case of 60≦W≦95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.
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Iji Masatoshi
Katayama Isao
Kiuchi Yukihiro
Matsui Yasuo
Oota Ken
NEC Corporation
Sellers Robert
Sumitomo Bakelite Company
Young & Thompson
LandOfFree
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