Flame retardant epoxy molding compound, method and encapsulated

Details Flame retardant epoxy molding compound, method and encapsulated Flame retardant epoxy molding compound, method and encapsulated

1993-03-01

1995-12-19

Marquis, Melvyn I.

Stock material or miscellaneous articles

Composite

Of epoxy ether

257702, 427 96, 523458, 523460, 523466, B32B 2738

Patent

active

054767164

ABSTRACT:
A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.

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