Flame retardant B-staged epoxy resin prepregs and laminates made

Details Flame retardant B-staged epoxy resin prepregs and laminates made Flame retardant B-staged epoxy resin prepregs and laminates made

1983-04-29

1985-02-26

Ives, Patricia C.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428248, 428251, 428285, 428288, 428290, 428415, 428432, 428460, 428464, 4284774, 428458, 428416, 428436, 428530, 428901, 428920, 174 685, B32B 700, B32B 1710, H05K 100

Patent

active

045017875

ABSTRACT:
A prepreg useful in flame resistant copper clad printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a prebrominated epoxy resin or a mixture of a non-halogenated epoxy resin and flame retarding additive containing bromine, and phenolic hydroxyl groups. A phenolic novolac oligomer having an average of over 2.5 phenolic hydroxyl groups per oligomeric unit is used as curing agent. Optionally, a suitable catalyst may be included. The impregnated substrate is heated to cure or advance the resin to the "B"-stage.

REFERENCES:
patent: 3536546 (1970-10-01), Nielsen et al.
patent: 3549478 (1970-12-01), Gillery et al.
patent: 3895158 (1975-07-01), Gause et al.
patent: 4021403 (1977-05-01), Fujiwara et al.

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