Fixture for testing mounting integrity of heat sinks on semicond

Details Fixture for testing mounting integrity of heat sinks on semicond Fixture for testing mounting integrity of heat sinks on semicond

1992-08-20

1994-08-16

Raevis, Robert

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73833, G01N 310

Patent

active

053376145

ABSTRACT:
A reliable, repeatable, well-characterized, safe technique for testing the mounting integrity of heat sinks adhered to semiconductor packages is disclosed. Generally, a semiconductor package is secured in a tensiometer, the heat sink is clamped and secured to the spindle of the tensiometer, and a stud-pull type test is conducted.

REFERENCES:
patent: 1008926 (1911-11-01), Saylor
patent: 2428111 (1947-09-01), Eldrup
patent: 2821080 (1958-01-01), Gemignani
patent: 3159127 (1964-12-01), Wheeler
patent: 3690160 (1972-09-01), Kriesten
patent: 4292852 (1981-10-01), Morris
patent: 4489363 (1984-12-01), Goldberg
patent: 4876896 (1989-10-01), Snow et al.
patent: 4895028 (1990-01-01), Mayer

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