Fixture for soldering integrated circuit chips to a multilayer s

Details Fixture for soldering integrated circuit chips to a multilayer s Fixture for soldering integrated circuit chips to a multilayer s

1976-12-30

1978-04-18

Jones, Jr., James L.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

228 441A, 269254MW, H01L 2160

Patent

active

040843157

ABSTRACT:
A fixture for use in soldering a large number of integrated circuit (IC) chips to a multilayer substrate in a single reflow soldering operation. A multilayer substrate with IC chips and their leads properly positioned on the substrate is placed within the base of the fixture. The force structure portion of the fixture is positioned on the base so that force pins, which are movable with respect to the force structure, can be lowered, or moved toward the substrate to apply the weight of a force pin to each IC chip to be soldered to the substrate. The weight, or force, of a force pin forces the back metal layer of each IC chip and its leads against a chip pad and chip lead pads of the substrate. The substrate is heated to melt, or to reflow, the solder on all the chip pads and chip lead pads. After the leads and back metal layer of each chip are wetted by the solder and while the solder is molten, the force structure is moved away from the base to remove the weight of the force pins from the IC chips.

REFERENCES:
patent: 3669333 (1972-06-01), Coucoulas
patent: 3887998 (1975-06-01), Hartleroad et al.
patent: 4018373 (1977-04-01), Beerwerth

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