Fixture for solder processing integrated circuit package leads

Details Fixture for solder processing integrated circuit package leads Fixture for solder processing integrated circuit package leads

1985-12-04

1987-04-07

McIntosh, John P.

Coating apparatus

Work holders, or handling devices

Gripper or clamped work type

269900, B05C 1302

Patent

active

046551646

ABSTRACT:
A fiberglass-reinforced epoxy base plate includes a matrix of integrated circuit package lead receiving apertures. A grooved cover locks the packages to the base plate with the leads projecting from the base plate. The projecting leads are dipped in an acid flux to remove oxidation. The leads are then tinned by passing them through a solder wave. The cover is loosened after tinning to allow the packages to resiliently move about and float. The fixture and its packages are immersed in a water bath to clean the packages. The grooves permit agitated bath water to loosen the resiliently held packages and thoroughly clean them without removing the packages from the fixture so that a single fixture is used for fluxing, tinning, and cleaning.

REFERENCES:
patent: 2475434 (1949-07-01), Moss
patent: 3395439 (1968-08-01), Palesi et al.
patent: 4286542 (1981-09-01), Belcher, Jr. et al.
patent: 4489923 (1984-12-01), Barresi et al.

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