Fixture for plating tall contact bumps on integrated circuit

Details Fixture for plating tall contact bumps on integrated circuit Fixture for plating tall contact bumps on integrated circuit

1988-10-05

1989-10-17

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

048744760

ABSTRACT:
A method of plating bumps on metallization on the face of a wafer, including the steps of placing the wafer in a transportable fixture wherein cathode needles press against the face of the wafer to make electrical contact and to force the back side of the wafer against a sealing member to prevent the plating bath from contacting the back side. The fixture with the wafer therein is placed in a clean up or presoak bath and is then transported to a plating bath without an operator having to touch the wafer.

REFERENCES:
patent: 2362228 (1944-11-01), Wright
patent: 3536594 (1970-10-01), Pritchard

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