Fixture for decapsulating plastic encapsulated electronic device

Details Fixture for decapsulating plastic encapsulated electronic device Fixture for decapsulating plastic encapsulated electronic device

1996-11-20

1998-08-11

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 83, B44C 122

Patent

active

057923051

ABSTRACT:
Apparatus for selectively etching a resinous encapsulant wall forming an electronic device package includes etching solution source; an etching assembly including an etch head and orifice for directing etchant solution onto an exterior surface of the package; a cover extending over an etch plate mounting the etch head and forming an etching chamger; a frame on the etch plate and in the chamber for mounting the package such that a package exterior surface is mounted against the etch head, the frame including a sealing gasket between the frame and the etch head and surrounding the orifice; and a ram for pushing and sealing the frame against the etch head peripherally outwardly of and surounding the etch head orifice. In a second embodiment the frame is an etch cup having a well with or without apertures for receiving package leads. In one embodiment the frame mounts a ball grid array package, the frame including a handle perventing contact of heated solder balls. Another embodiment includes a universal positioner for locating one or more devices in a device package extending over the etch head orifice.

REFERENCES:
patent: 4826556 (1989-05-01), Kobayashi
patent: 5443675 (1995-08-01), Wensink
Model 250 Operation, Installation and Service Manual.

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